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Alumina Ceramic Substrates Unmatched Insulation And Thermal Conductivity For High-End Applications

Dayoo Advanced Ceramic Co.,Ltd
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    Buy cheap Alumina Ceramic Substrates Unmatched Insulation And Thermal Conductivity For High-End Applications from wholesalers
     
    Buy cheap Alumina Ceramic Substrates Unmatched Insulation And Thermal Conductivity For High-End Applications from wholesalers
    • Buy cheap Alumina Ceramic Substrates Unmatched Insulation And Thermal Conductivity For High-End Applications from wholesalers

    Alumina Ceramic Substrates Unmatched Insulation And Thermal Conductivity For High-End Applications

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    Alumina Ceramic Substrates Unmatched Insulation And Thermal Conductivity For High-End Applications

    Alumina Ceramic Substrates Unmatched Insulation And Thermal Conductivity For High-End Applications


    Product Overview

    Alumina ceramic heat sink substrates are advanced electronic cooling materials manufactured from high-purity aluminum oxide (Al₂O₃). These substrates feature excellent thermal conductivity, electrical insulation, and mechanical strength. Utilizing cutting-edge ceramic processing technology, they offer superior surface flatness and thermal expansion coefficients that match semiconductor materials, making them ideal heat dissipation carriers for power electronic devices.

    Key Applications

    • LED Lighting: Heat sinks for high-power LED chips

    • Power Electronics: IGBT modules and power semiconductor devices

    • Telecom Equipment: 5G base station power amplifiers

    • Automotive Electronics: New energy vehicle control systems

    Product Advantages

    1. Exceptional Thermal Conductivity: 24-28W/(m·K)

    2. High Insulation Performance: Breakdown voltage >15kV/mm

    3. Low Thermal Expansion: Matches chip expansion (7.2×10⁻⁶/℃)

    4. High-Temperature Resistance: Continuous operation up to 1000℃

    5. Superior Mechanical Strength: Flexural strength >300MPa

    Technical Specifications

    ParameterSpecification
    Material Purity96%/99% Al₂O₃ options
    Thermal Conductivity24-28W/(m·K)
    Breakdown Voltage>15kV/mm
    Surface RoughnessRa≤0.2μm
    Thermal Expansion7.2×10⁻⁶/℃(20-300℃)
    Standard Sizes50×50mm to 150×150mm
    Thickness Range0.3-3.0mm

    Manufacturing Process

    1. Powder Preparation: Fine grinding of high-purity alumina

    2. Tape Casting: Producing high-precision green tapes

    3. High-Temp Sintering: 1600-1700℃ densification

    4. Precision Machining: Laser cutting, surface polishing

    5. Metallization: Screen printing/sputtering

    6. Quality Control: Thermal/insulation testing

    Usage Guidelines

    1. Maintain clean surfaces during installation

    2. Use thermal paste for better heat transfer

    3. Avoid mechanical impacts to prevent cracking

    4. Regularly inspect surface conditions

    Service Commitment

    • 18-month quality guarantee

    • Professional technical support

    • Rapid response to inquiries

    • Sample testing and small-batch customization

    FAQ

    Q: Advantages vs aluminum substrates?
    A: Better insulation, heat resistance, and dimensional stability

    Q: Minimum achievable thickness?
    A: 0.3mm (0.5mm recommended)

    Q: Custom shapes available?
    A: Yes, with minimum 0.5mm hole diameter



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